Process Associate Engineer
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About Stats ChipPAC
At Stats ChipPAC, we are at the forefront of the global semiconductor Outsourcing Assembly and Test (OSAT) industry, enabling tomorrow’s technology — from mobile devices to high-performance computing. Join our dynamic team where innovation, teamwork, and excellence drive our success. We are employing Advanced Manufacturing Technologies in our Wafer-Level Packaging operations with wide adoption of Automation, AI-enabled inspection and Autonomous Mobile Robots (AMR) as substitute to manual operations.
Scope of the Job:
Manage the assigned processes in the production line.
Responsible for firsthand investigation, defect mapping, affected lot list compilation and resolution of the problem, timely closure of Inspection Reject Report and lot disposition.
Support NPI lot, engineering evaluation runs and data compilation.
Responsible for recipe creation, machine buyoff and SPC monitoring.
Participate in the cost saving, yield improvement and productivity activities.
Required Experience and Qualifications:
Diploma in Mechanical and Material Engineering or equivalent.
Experience in the following Semicon processes is preferred: Die/Package Pick & Place, Oven Reflow, Underfill, Molding, Plasma and Laser Mark, Back Grind, Die Sort, Laser Groove, Wafer Saw, AOI and Yield.
Strong process orientation.
Good Initiative & follow-up.
Great problem-solving skill.
Why Join Us?
Be part of an industry leader shaping the future of semiconductors
Work with cutting-edge technologies and state-of-the- artwork equipment
Clear career development pathways and mentorship from industry experts
Dynamic, multicultural workplace that values collaboration and innovation
Comprehensive benefits and employee-centric policies
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